Oxygen

Specification    

Purity,% 99.995 99.999 99.9997
Argon    

≤1.0 ppmv
Nitrogen ≤25.0 ppmv ≤5.0 ppmv ≤1.0 ppmv
Carbon dioxide ≤0.5 ppmv ≤0.1 ppmv ≤0.1 ppmv
Carbon monoxide ≤0.5 ppmv ≤0.1 ppmv ≤0.1 ppmv
Total hydrocarbon (CH4) ≤0.5 ppmv ≤0.1 ppmv ≤0.1 ppmv
Moisture ≤2.0 ppmv ≤0.5 ppmv ≤0.1 ppmv
Argon ≤3.0 ppmv ≤3.0 ppmv
Hydrogen ≤1.0 ppmv ≤0.1 ppmv ≤0.1 ppmv

transportation    

DOT shipping name Oxygen, compressed

DOT classification 2.2

DOT label Non-flammable gas

UN NO. UN 1072

CAS No. 7782-44-7

CGA/DISS/JIS/BS341/DIN477 540/714/W22-14R/NO.3/NO.9

Transport state Compressible gas

Technical Information

Cylinder condition @ 21.1°C gas

The combustion limit in the air is not combustible

Natural temperature (°C)-

Molecular weight (g/mol) 31.999

Specific gravity (air =1) 1.105

Critical temperature (°C) -118.57

Critical temperature (psig) 714.4

Application

1. It is the component of standard gas.
2. Emergency treatment in emergencies such as suffocation and heart disease.
3. In the treatment of patients with respiratory diseases.
4. Anesthesia.
5. Research in chemical oxidation reactions.
6. In semiconductor manufacturing, chemical vapor deposition of silicon dioxide.
7. In semiconductor manufacturing, thermal oxidation growth.
8. In semiconductor manufacturing, plasma etching.
9. In semiconductor manufacturing, plasma stripping of photoresist.
10. In semiconductor manufacturing, certain deposition/diffusion operations in carrier gas.