Understand the semiconductor material preparation process, Boyee provides professional solutions

With the continuous advancement of science and technology, semiconductor wafers, as core components of the modern electronics industry, are receiving increasing attention for their processing technology and material preparation technology.

This article will discuss the preparation process and methods of key semiconductor wafer preparation materials such as photoresist, polishing solution, and lead zirconate titanate.

The important role of Boyee grinding and dispersing equipment in the preparation of these materials and its technical highlights are also emphasized.

01

Brief description of the preparation process of key semiconductor materials

Photoresist paste : The preparation of photoresist paste is a process involving complex chemical reactions and precise process control.

First, according to a preset formula, raw materials such as pigments, dispersants, and solvents are mixed to form a preliminary mixture.

Subsequently, the mixture was placed in a Boyee sand mill and ground and dispersed to achieve the desired particle size distribution.

The chemical reaction is carried out under strictly controlled temperature and stirring conditions to ensure that all components react fully to form a uniform photoresist solution.

In order to further optimize the particle size and dispersibility , the mixture needs to be subjected to high-pressure microfluidization homogenization and dispersion treatment.

Afterwards, the slurry after grinding and homogenization is filtered through a filter element to remove large particles, metal ions and other pollutants to ensure the purity of the photoresist.

Factors such as particle size, particle size distribution, and uniformity of photoresist color paste play an important role in photoresist performance and subsequent processes.

In this process, Boyee sand grinder plays a key role by accurately controlling the mechanical strength.

It can effectively prevent insufficient mechanical energy from breaking up agglomerates or excessive mechanical energy from causing secondary damage to particles, thereby ensuring that the finished product has a narrow particle size distribution and good uniformity.

Polishing liquid: The preparation of polishing liquid includes key ingredients such as raw materials, polishing aids, solvents and nano-abrasive particles.

The particle size and shape of the polishing slurry abrasive have a crucial impact on the effectiveness of the CMP process.

With its patented turbine grinding system, Boyee sand grinder is able to grind polishing liquid abrasives to nanometer level, and the abrasives produced have regular shapes and good uniformity.

This makes the surface of semiconductor wafers produced by the CMP process more flat and smooth, improving the polishing effect and product quality.

Lead Zirconate Titanate : The wet grinding process of lead zirconate titanate is a delicate process that begins with mixing high-purity lead oxide, zirconium dioxide and titanium dioxide in precise proportions.

It is then put into a sand mill together with an appropriate amount of solvent for a long period of grinding to ensure that a powder with fine particle size and uniform distribution is obtained.

In this process, the control of grinding time, rotation speed and solvent ratio is crucial.

Subsequently, impurities are removed and the powder is dried through filtering, washing and drying steps. In order to improve the fluidity and molding properties of the powder, granulation treatment is also required.

02

Optimizing the preparation process to create stable semiconductor crystals

In the preparation process of semiconductor crystals, precise control of equipment parameters and preparation processes is the key to ensuring the quality and stable performance of the final product.

As an industry-leading grinding and dispersing solution provider, Boyee is well aware of its importance.

We also actively help companies achieve more stable and efficient semiconductor crystal production through technological innovation and service optimization.

Pictured: We sincerely invite you to visit Semicon Taiwan booth: Booth: 13126, exhibition time: September 4-6, 2024

In addition to the control of equipment parameters, optimization of the preparation process is also the key to improving the quality of semiconductor crystals.

Boyee has accumulated rich experience in preparation process optimization through in-depth research and practice.

We not only provide advanced grinding and dispersing equipment for the research and development of semiconductor wafers, but also tailor-make personalized preparation plans and processes according to the specific needs of enterprises , helping them to effectively improve the overall quality of their products.